Role
Sole designer. Developed brand identity from founder brief through logo system, typography selection, and colour palette. Delivered comprehensive design documentation for investor-readiness.
Context
TennaSonic is developing thermally-resilient Antenna-in-Package (AiP) technology for 5G/6G, satellite, and radar applications. The founder — a physics doctoral researcher — needed a credible visual identity ahead of a significant funding round. B2B positioning targeting smartphones, base stations, automotive, and IoT.
Logo System
The AiP Stack mark represents multi-layer package structure — each row a distinct substrate layer (antenna, redistribution, interconnect, die).
Approach
Started with founder-generated digital concepts as input. Analysed sector conventions across semiconductor, telecom, and deep-tech competitors. Identified risks in initial directions (WiFi-arc associations, generic tower iconography) and developed alternative mark directions grounded in the actual technology.
Key decision: The AiP Stack mark directly references antenna-in-package layer structure — LTCC ceramic, HDI organic, or eWLB mold compound. This makes the mark technically meaningful rather than generic telecom signalling.
Typography
−40 °C → +85 °C · Sub-THz
Weight rules: Wordmark Bold/700 · Tagline Light/300 · Body Regular/400
Never use italic — precision hardware brands imply permanence, not motion.
Colour System
Drawn from antenna-in-package fabrication: machined aluminium, tungsten via-fills, copper RF traces, anechoic chambers.
The engineering register that commands technical credibility. If a logo doesn't work in black on white, it doesn't work.
Documentation
Outcomes
- Complete logo system delivered
- Design documentation structured for investor and partner distribution
- Mark direction differentiated from sector conventions
Case study describes role, process, and design decisions. All work shown is the property of the designer.